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OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks
At OCP Summit 2026, Meta unveiled next-generation open networking infrastructure for AI, including IcePack, its first liquid-cooled network rack, and IceCube, a 102.4T switch blade delivering 128×800G non-blocking capacity. The Flattened Planar Fabric (FPF) introduces a multiplane scale-out design where each GPU connects via eight independent 100G links to different switches, reducing latency and enabling larger clusters. Meta also shared its BAG super-spine for multi-site aggregation and Tahan, an Ethernet-based 51.2T scale-up switch for MTIA 300 systems. The company launched the Open Switch Platform Architecture (OSPA) initiative with Microsoft and Alibaba to standardize switch platform hardware and software interfaces. Additionally, Meta announced open-source implementations of MetaRoCE, its RDMA transport protocol optimized for AI cluster networks over Ethernet.
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